TePla O2 Etcher

Location: Upper Level Cleanroom, Room 178

The TePla O₂ Etcher is an open-load plasma asher, useful for removing organic resists from substrates, surface plasma cleaning, or surface modification/roughening of select materials. Samples can be placed on either biased, or grounded electrodes, allowing for either more, or less, aggressive plasma treatments. Available gases are O₂, Ar, and CF₄. It can operate between 0-2000 mTorr, with 0-600W RF power at 13.56 MHz. It can accommodate samples up to 200 mm in diameter. This tool is ideal for gentle descum cleans, or for stripping resist from substrates, but users looking for uniform, controllable etching should seek another tool. An optional Faraday Cage is available to minimize ion damage on sensitive devices.